H05K 7/20645
Within cabinets for removing heat from sub-racks
Official title: {within cabinets for removing heat from sub-racks}
H05K7/20645 (Within cabinets for removing heat from sub-racks) appears on 98 US grants and 108 published applications in this corpus.
Search patents in H05K- Granted patents
- 98
- Published applications
- 108
- Assignees
- 87
- Inventors
- 262
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 0 | 4 |
| 2008 | 2 | 6 |
| 2009 | 2 | 1 |
| 2010 | 5 | 3 |
| 2011 | 5 | 9 |
| 2012 | 3 | 4 |
| 2013 | 4 | 7 |
| 2014 | 3 | 5 |
| 2015 | 5 | 4 |
| 2016 | 11 | 8 |
| 2017 | 3 | 2 |
| 2018 | 1 | 3 |
| 2019 | 6 | 3 |
| 2020 | 6 | 7 |
| 2021 | 3 | 7 |
| 2022 | 4 | 0 |
| 2023 | 3 | 14 |
| 2024 | 8 | 7 |
| 2025 | 6 | 5 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Housing for immersive liquid cooling of multiple electronic devices26 May 2026US 12,641,748 B2Iceotope Group Limited
- Systems and methods for electronics cooling24 Mar 2026US 12,588,164 B2Eagle Technology, LLC
- Electronic assembly, casing assembly and electronic apparatus10 Mar 2026US 12,575,048 B2Wistron Corporation
- Cooling system of an electronic module with a leakage control device24 Feb 2026US 12,563,697 B2Saab AB
- Coolant distribution unit and control system20 Jan 2026US 12,532,433 B2Hoffman Enclosures, Inc.
- Housing for immersive liquid cooling of multiple electronic devices24 Sep 2026US 2026/0293040 A1Iceotope Group Limited
- Snap-in connector, heat exchanger with a snap-in connector and cooling system16 Jul 2026US 2026/0206188 A1Infineon Technologies Austria AG
- Coolant distribution unit and control system14 May 2026US 2026/0136496 A1Hoffman Enclosures, Inc.
- Computing cabinet and related computing system16 Apr 2026US 2026/0107409 A1Tesla, Inc.
- Controllable connection mechanism5 Mar 2026US 2026/0068101 A1Dell Products L. P.
Most cited
By later US patents
- Electronic apparatus and method of cooling the same157US 5,323,847 AHitachi, Ltd. · 1994
- Liquid-air hybrid cooling in electronics equipment86US 7,701,714 B2Flextronics AP, LLC · 2010
- High density storage system83US 7,573,715 B2Tempest Microsystems · 2009
- Cold chassis for cooling electronic circuit components on an electronic board80US 4,962,444 ASunstrand Corporation · 1990
- Method and apparatus for cooling electronic components74US 7,011,143 B2International Business Machines Corporation · 2006