Electronic assembly, casing assembly and electronic apparatus

An electronic assembly, slidably disposed in a casing and thermally coupled to a heat dissipation unit in the casing, the electronic assembly comprising:

• an electronic unit, comprising an electronic main body, wherein the electronic main body is provided with an inclined surface, and the inclined surface is inclined relative to the electronic main body;
• and
• at least one thermal interface material, disposed on the inclined surface, wherein the at least one thermal interface material is used to be filled in a gap between the electronic assembly and the heat dissipation unit.

A casing assembly, comprising:

• a casing, comprising a plurality of side plates, wherein the plurality of side plates surround an accommodation space, sides of the plurality of side plates surround an installation opening, and the installation opening communicates with the accommodation space;
• and
• a heat dissipation unit, disposed in the accommodation space and comprising a heat dissipation main body, wherein the heat dissipation main body is provided with an inclined surface, and the inclined surface is inclined relative to the heat dissipation main body from the installation opening along a direction away from the installation opening.