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US 4,962,444 AGranted
Cold chassis for cooling electronic circuit components on an electronic board
AssigneeSunstrand Corporation
InventorRichard E. Niggemann
Life of this patent
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AssigneeSunstrand Corporation
InventorRichard E. Niggemann
Estimating the term…
The problem of providing a compact high intensity cooling system for use with a cold chassis (42) for an electronic board (18) in a modular electronic system is solved by providing a frame (44) having a plurality of projecting ribs (46) defining grooves (48) for receiving edges of electronic boards. The ribs each include a plurality of impingement orifice plates (66a, 66b), spacer plates (68) and manifold plates (70a, 70b). The impingement orifice plates and the spacer plates cooperate to define first and second tortuous flow paths generally parallel to each other and perpendicularly to the plates for dual cooling fluid circuits. The manifold plates are disposed at opposite ends of the stack and define flow passages for distributing the cooling fluid to the tortuous flow paths. Inlets (78, 80) and outlets (90, 92) to and from the flow passages (72, 74) of the manifold plates are provided at a common edge of the stack of plates in communication directly through the frame to headers (50, 52, 54, 56) on the opposite side of the frame.
A cold chassis for an electronic board in a modular electronic system, comprising a frame having a plurality of projecting ribs defining at least one groove for receiving an edge of the electronic board with the board in engagement with at least one of the ribs, at least the one rib including a plurality of spaced impingement orifice plates defining a tortuous flow path through the one rib, and inlet and outlet means from the frame to the flow path for a cooling fluid to flow through the impingement orifice plates and exchange heat from the electronic board.
A cold chassis for an electronic board in a modular electronic system, comprising a frame having a plurality of projecting ribs defining at least one groove for receiving an edge of the electronic board with the board in engagement with at least one of the ribs, at least the one rib incluidng a plurality of spaced impingement orifice plates defining a tortuous flow path through the one rib, and at least one manifold plate defining at least part of a flow passage means for distributing the coolant fluid to the flow passage means for distributing the coolant fluid to the tortuous flow path, and inlet and outlet means formed at an edge of the at least one rib communicating a cooling fluid from the frame to the flow passage means of the manifold plate, and thereby, to the impingement orifice plates for exchanging heat from the electronic board.
A cold chassis for an electronic board in a modular electronic system, comprising a frame having a plurality of projecting ribs defining at least one groove for receiving an edge of the electronic board with the board in engagement with at least one of the ribs, at least the one rib including impingement orifice plates, spacer plates and manifold plates, the impingement orifice plates and the spacer plates cooperating to define first and second tortuous flow paths perpendicularly through the plates for independent fluid flow circuits, and the manifold plates, defining at least part of a flow passage means for distributing the liquid to the first and second tortuous flow paths.
In a cold chassis for an electronic board of a modular electronic system wherein modules are plugged in grooves in the chassis to form an assembly, the grooves being formed by ribs, and at least one rib being formed entirely by a stack of plates including impingement orifice plates and manifold plates, the impingement orifice plates defining a tortuous flow path perpendicularly through the plates for a cooling fluid, and the manifold plates defining opposite ends of the stack and including flow passage means for distributing the cooling fluid to the tortuous flow path.
Dependencies are inferred from the claim text.