US 4,493,010 AGranted

Electronic packaging module utilizing phase-change conductive cooling

AssigneeLockheed Corporation

InventorsRobert A. Morrison, Attila Frink

Life of this patent

Estimating the term…

Loading patent…

Abstract

Each individual module includes a sealed chamber containing the electronic components being cooled, the liquid cooling medium, and at least one minature evaporator. The evaporator's outer surface area is in direct contact with the cooling medium, so as to maintain it at a desired temperature. Preferably, in order to minimize the weight associated with the liquid cooling medium and in order to compensate for its coefficient termal expansion and the associated internal pressure variation, the chamber may be packed with resilient spheres that will displace a substantial quantity of the cooling medium without a corresponding increase in its effective viscosity (and thus without any substantial effect on the liquid's capability of transferring heat from the components to the evaporator by means of thermal convection currents). The mechanical, electrical and refrigerant connections between the module and the other assemblies of the avionics system are such that the individual module may be readily removed and replaced thereby further enchancing the overall maintainability of the system. An expansion bladder vented to the external environment may also be provided within the chamber.

An electronics packaging assembly comprising in combination:

a plurality of circuit board modules each comprising;
a housing having a chamber therein;
an inlet refrigerant fitting coupling the exterior of said module to said chamber, said inlet fitting having an inlet line extending into said chamber;
an outlet refrigerant fitting coupling the exterior of said housing to said chamber, said outlet fitting having an outlet line extending into said chamber;
a plurality of electronic components within said chamber;
electrical termination means external to said module for making electrical connection to said electronic components inside said chamber;
an evaporator within said chamber, said evaporator being connected to said inlet line and said outlet line within said chamber;
an inert coolant liquid contained inside said chamber in surface contact with said electronic components and with said evaporator so as to facilitate the transfer of heat therebetween;
and
means for retaining said liquid inside said chamber;
whereby when a compressed refrigerant liquid is introduced into said module via said inlet fitting, it may experience a change of phase within said evaporator and thereby absorb heat from said evaporator and the surrounding portion of said coolant liquid in surface contact therewith so as to maintain said coolant at a first temperature within a predetermined first temperature range which in turn will result in said electronic components being maintained within a predetermined second temperature range related to said first temperature by a predetermined differential temperature range;
a refrigeration compressor;
a refrigeration condensor;
a rack for holding said modules;
a plurality of inlet couplings attached to said rack;
a plurality of outlet couplings attached to said rack;
a plurality of external refrigerant lines respectively connecting said outlet couplings to said compressor, said compressor to said condensor, and said condensor to said inlet couplings;
a plurality of electrical connectors secured to said rack, at least one of said connectors being provided for each of said modules;
and
means for removing a particular one of said modules from a first position wherein said inlet fitting of said particular module is in gas-tight connection with a corresponding one of said inlet couplings, said outlet fitting of said particular module is in gas-tight connection with a corresponding one of said outlet couplings, and said electrical termination means of said particular module is in electrical connection with a corresponding one of said electrical connectors to a second position wherein there is no fluid connection between said module and said external refrigerant lines and no electrical connection between said module and said electrical connectors.

17 more elements

Abstract

Claims12