Combination conductive and convective heatsink

A combination conductive and convective heatsink for mounting with a mother board within an electronic module mounting rack comprising;

• at least one electronic circuit element having a predetermined coefficient of thermal expansion;
• a heatsink member mounted and thermally engaged with said electronic circuit element, including a composite of first and second materials, said first material having a first coefficient of thermal expansion and said second material having a second coefficient of thermal expansion, said first and second materials being combined in a quantity ratio to produce a composite heatsink member with a combined coefficient of thermal expansion which closely matches the predetermined coefficient of thermal expansion of said electronic circuit element;
• a plurality of flow-through channels in said heatsink member adapted for engaging flow-through passages in the electronic module mounting rack;
• and
• a plurality of thermally conductive members in said heatsink member, adapted for conductively engaging said electronic module mounting rack.

An electronic module having a combination conductive and convective heatsink for mounting with a mother board within an electronic module mounting rack comprising:

• two electronic circuit boards having a predetermined coefficient of thermal expansion;
• a heatsink mounting and thermally engaging with said electronic circuit boards, including a composite of first and second materials, said first material having a first coefficient of thermal expansion and said second material having a second coefficient of thermal expansion, said first and second materials being combined in a quantity ratio to produce a composite heatsink with a combined coefficient of thermal expansion which closely matches the predetermined coefficient of thermal expansion of said electronic circuit boards;
• a plurality of flow-through channels in said heatsink for engaging flow-through passages in the electronic module mounting rack;
• and
• a plurality of heat pipes in said heatsink alternating in placement with said flow-through channels and adapted for conductively engaging said electronic module mounting rack for conveying heat from said circuit boards to said mounting rack.