Heat dissipation device and electronic equipment having the same

An electronic equipment comprising:

• a component to be cooled;
• a heat dissipation device comprising:
• a heat-conducting mounting assembly configured to install the component to be cooled and cooperate with the component to be cooled in a heat-conducting manner;
• and
• a heat dissipation mechanism comprising a first heat dissipation assembly and a second heat dissipation assembly, and the first heat dissipation assembly and the second heat dissipation assembly detachably connected and inserted in the heat-conducting mounting assembly;
• wherein each of the first heat dissipation assembly and the second heat dissipation assembly comprises a bearing member, a heat dissipation member, a magnetic member, and a magnetic pressing member, the bearing member is arranged on a side of the heat-conducting mounting assembly and a receiving groove penetrates the bearing member, the heat dissipation member is arranged in the receiving groove, a part of the heat dissipation member protrudes out of the receiving groove and extends into the heat-conducting mounting assembly for abutting against the component to be cooled in the heat-conducting mounting assembly, the magnetic member is arranged in the heat dissipation member, the magnetic pressing member covers a notch of the receiving groove of the bearing member and the magnetic pressing member is located on a side of the heat dissipation member facing away from the heat-conducting mounting assembly, the magnetic pressing member is used to act on the magnetic member through a magnetic force, thereby allowing the magnetic member to abut against the heat dissipation member and allowing the heat dissipation member to press against the component to be cooled in the heat-conducting mounting assembly.