Heat dissipation apparatus, device, rack, and system

A heat dissipation apparatus, comprising:

• a heat-conducting plate, wherein the heat-conducting plate comprises a first surface and a second surface that are opposite to each other, and a liquid channel is disposed on the first surface;
• a mounting base, wherein an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that comprises the second surface is disposed on the mounting base, and an area of the second surface of the heat-conducting plate is greater than or equal to a surface area of a to-be-heat-dissipated chip, and the second surface is a surface of the heat-conducting plate that is used to conduct heat for the chip;
• and
• a pressing plate configured to fasten the heat-conducting plate in the accommodation cavity, wherein the pressing plate is detachably connected to the mounting base, the pressing plate seals the liquid channel disposed on the first surface of the heat-conducting plate to form a sealing cavity accommodating the liquid channel, and a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.