H05K 2203/175
Configurations of connections suitable for easy deletion
Official title: Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
H05K2203/175 (Configurations of connections suitable for easy deletion) appears on 473 US grants and 328 published applications in this corpus.
Search patents in H05K- Granted patents
- 473
- Published applications
- 328
- Assignees
- 320
- Inventors
- 1,015
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 5 | 0 |
| 1978 | 5 | 0 |
| 1979 | 8 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 8 | 0 |
| 1993 | 9 | 0 |
| 1994 | 11 | 0 |
| 1995 | 10 | 0 |
| 1996 | 13 | 0 |
| 1997 | 10 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 16 | 8 |
| 2002 | 24 | 13 |
| 2003 | 16 | 15 |
| 2004 | 13 | 18 |
| 2005 | 6 | 18 |
| 2006 | 17 | 28 |
| 2007 | 14 | 27 |
| 2008 | 15 | 23 |
| 2009 | 15 | 27 |
| 2010 | 17 | 17 |
| 2011 | 12 | 10 |
| 2012 | 15 | 14 |
| 2013 | 15 | 11 |
| 2014 | 8 | 14 |
| 2015 | 9 | 11 |
| 2016 | 14 | 12 |
| 2017 | 11 | 6 |
| 2018 | 12 | 10 |
| 2019 | 13 | 6 |
| 2020 | 6 | 3 |
| 2021 | 3 | 6 |
| 2022 | 7 | 5 |
| 2023 | 4 | 7 |
| 2024 | 3 | 8 |
| 2025 | 3 | 4 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device17 Feb 2026US 12,557,435 B2Innolux Corporation
- Light-emitting substrate, method for manufacturing the same, and display device6 Jan 2026US 12,520,641 B2Boe Technology Group Co., Ltd.
- Electroplating edge connector pins of printed circuit boards without using tie bars25 Nov 2025US 12,484,156 B2NVIDIA Corporation
- Wiring substrate2 Sep 2025US 12,408,276 B2Niterra Co., Ltd.
- System and method for disabling Wi-Fi on the handheld console26 Aug 2025US 12,401,328 B2Fully Loaded Electronics, LLC
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
- Computing device25 Jun 2026US 2026/0180445 A1
- Array printed circuit board, and printed circuit board and manufacturing method of the same4 Jun 2026US 2026/0156740 A1Samsung Electronics Co., Ltd.
- Electronic device21 May 2026US 2026/0143859 A1Innolux Corporation
- Flexible die-cut circuit board and method of manufacturing same30 Apr 2026US 2026/0122777 A1SK On Co., Ltd.
Most cited
By later US patents
- Multi-layer circuit construction methods with customization features158US 5,282,312 ATessera, Inc. · 1994
- Thermally assisted shorts removal process for glass ceramic product using an RF field149US 5,290,986 AInternational Business Machines Corporation · 1994
- Capacitor with defect isolation and bypass118US 6,452,776 B1Intel Corporation · 2002
- High speed multi-layer printed circuit board via117US 6,541,712 B1Teradyhe, Inc. · 2003
- Method of making a chip carrier package using laser ablation111US 6,660,559 B1Amkor Technology, Inc. · 2003