Wiring substrate
AssigneeNiterra Co., Ltd.
InventorKensuke Matsuhashi
Life of this patent
Estimating the term…
Abstract
A wiring substrate (1) includes an insulating substrate (11), a surface metal layer provided on a surface of the insulating substrate (11), and a wiring layer disposed in an inner part of the insulating substrate (11). The surface metal layer (for example, a lead wiring portion (52)) is divided by a groove (61). The wiring layer (for example, an internal wiring trace (32)) is disposed in such a manner that, as viewed from above, the wiring layer detours around a region where the groove (61) is formed so as not to overlap with the region where the groove (61) is formed.
Claims3
A wiring substrate comprising:
- an insulating substrate;
- a surface metal layer provided on a surface of the insulating substrate and divided by a groove formed on the insulating substrate;
- and
- a wiring layer disposed in an inner part of the insulating substrate,
- wherein an insulating coat layer is provided around the groove,
- wherein the wiring layer is disposed in such a manner that, as viewed from above, the wiring layer detours around a region where the groove is formed and a region where the insulating coat layer is formed so as not to overlap with the region where the groove is formed and the region where the insulating coat layer is formed, and
- wherein an internal metal layer is further provided in an inner part of the insulating substrate, and the internal metal layer has an opening formed in a region which overlaps with the region where the groove is formed as viewed from above in such a manner that the opening contains the entirety of the region where the groove is formed.
A wiring substrate comprising:
- an insulating substrate;
- a surface metal layer provided on a surface of the insulating substrate and divided by a groove formed on the insulating substrate;
- and
- a wiring layer disposed in an inner part of the insulating substrate,
- wherein an insulating coat layer is provided around the groove,
- wherein the wiring layer is disposed in such a manner that, as viewed from above, the wiring layer detours around a region where the groove is formed and a region where the insulating coat layer is formed so as not to overlap with the region where the groove is formed and the region where the insulating coat layer is formed, and
- wherein the wiring layer is provided at a position located 0.5 mm or less from the surface of the insulating substrate.
Dependencies are inferred from the claim text.