H05K 2203/1316
Moulded encapsulation of mounted components
H05K2203/1316 (Moulded encapsulation of mounted components) appears on 689 US grants and 823 published applications in this corpus.
Search patents in H05K- Granted patents
- 689
- Published applications
- 823
- Assignees
- 377
- Inventors
- 1,665
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 3 |
| 2003 | 2 | 1 |
| 2004 | 2 | 8 |
| 2005 | 2 | 10 |
| 2006 | 5 | 25 |
| 2007 | 15 | 16 |
| 2008 | 10 | 30 |
| 2009 | 13 | 23 |
| 2010 | 14 | 46 |
| 2011 | 22 | 33 |
| 2012 | 25 | 31 |
| 2013 | 26 | 35 |
| 2014 | 22 | 33 |
| 2015 | 25 | 45 |
| 2016 | 29 | 39 |
| 2017 | 36 | 64 |
| 2018 | 52 | 67 |
| 2019 | 75 | 71 |
| 2020 | 70 | 70 |
| 2021 | 61 | 42 |
| 2022 | 47 | 41 |
| 2023 | 28 | 26 |
| 2024 | 35 | 31 |
| 2025 | 24 | 19 |
| 2026 | 13 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Semiconductor package having semiconductor chip on wiring layers and method of fabricating the same21 Jul 2026US 12,690,478 B2Samsung Electronics Co., Ltd.
- Transfer molding systems for semiconductor device packaging14 Jul 2026US 12,684,696 B2Apple Inc.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Circuit board, battery pack, and method of manufacturing circuit board20 Aug 2026US 2026/0247543 A1Murata Manufacturing Co., Ltd.
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Electronic package and method for making the same9 Jul 2026US 2026/0197934 A1JCET STATS ChipPAC Korea Limited
- Molding compound application in printed circuit board by three dimensional (3d) stacking2 Jul 2026US 2026/0190232 A1Google Inc.
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Solar photovoltaic inverters128US 8,542,512 B2Enecsys Limited · 2013