Transfer molding systems for semiconductor device packaging

A molding system, comprising:

• a first mold-forming structure;
• a second mold-forming structure comprising a cavity, wherein the cavity comprises:
• a gate region,
• a component region adjacent to the gate region and configured to enclose an electrical component mounted on a substrate, and
• a vent region comprising a channel region positioned on the substrate and an adjustable reservoir region;
• and
• an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the cavity.

A molding system, comprising:

• a first mold-forming structure on a first side of a substrate;
• a second mold-forming structure comprising a cavity, wherein the cavity comprises:
• a gate region on a second side of the substrate,
• a component region configured to enclose an electrical component mounted on the second side of the substrate, and
• a vent region comprising an adjustable reservoir region non-overlapping with the substrate and a non-adjustable reservoir region overlapping with the substrate;
• and
• an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the cavity.