H05K 2203/095
Plasma
Official title: Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
H05K2203/095 (Plasma) appears on 356 US grants and 381 published applications in this corpus.
Search patents in H05K- Granted patents
- 356
- Published applications
- 381
- Assignees
- 265
- Inventors
- 1,125
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 8 | 0 |
| 1986 | 14 | 0 |
| 1987 | 9 | 0 |
| 1988 | 10 | 0 |
| 1989 | 10 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 8 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 3 |
| 2002 | 9 | 12 |
| 2003 | 8 | 13 |
| 2004 | 11 | 17 |
| 2005 | 3 | 16 |
| 2006 | 7 | 19 |
| 2007 | 7 | 15 |
| 2008 | 3 | 13 |
| 2009 | 9 | 24 |
| 2010 | 8 | 19 |
| 2011 | 8 | 15 |
| 2012 | 9 | 11 |
| 2013 | 11 | 17 |
| 2014 | 9 | 17 |
| 2015 | 12 | 20 |
| 2016 | 9 | 11 |
| 2017 | 10 | 18 |
| 2018 | 9 | 16 |
| 2019 | 18 | 14 |
| 2020 | 15 | 12 |
| 2021 | 9 | 25 |
| 2022 | 12 | 11 |
| 2023 | 11 | 14 |
| 2024 | 9 | 11 |
| 2025 | 6 | 10 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Electronic assemblies including a conformal moisture barrier26 May 2026US 12,635,857 B2Intuitive Surgical Operations, Inc.
- Method of making an interconnect substrate14 Apr 2026US 12,604,395 B2Shinko Electric Industries Co., Ltd.
- Producing method of wired circuit board27 Jan 2026US 12,538,431 B2Nitto Denko Corporation
- Protective coating13 Jan 2026US 12,521,756 B2
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- High-voltage printed circuit board with integrated plasma discharge electrodes for scalable plasma-based water treatment systems13 Aug 2026US 2026/0239528 A1Black Spark Inc
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001