H05K 2203/097
Corona discharge
H05K2203/097 (Corona discharge) appears on 13 US grants and 19 published applications in this corpus.
Search patents in H05K- Granted patents
- 13
- Published applications
- 19
- Assignees
- 20
- Inventors
- 73
- Latest grant
- 17 Dec 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 0 | 5 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 2 |
| 2016 | 0 | 2 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 2 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured thereby17 Dec 2019US 10,512,175 B2Amogreentech Co., Ltd.
- Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit5 Nov 2019US 10,470,312 B2Dic Corporation (Tokyo)
- Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component18 Apr 2017US 9,629,253 B2DIC Corporation
- Photonic heating of silver grids13 May 2014US 8,722,322 B2Eastman Kodak Company
- Hydrophilic treatment method and wiring pattern forming method30 Aug 2011US 8,007,649 B2Shinko Electric Industries Co., Ltd.
- Encapsulating electronics on flexible fluoroelastomer substrates25 Apr 2024US 2024/0138061 A1Saudi Arabian Oil Company
- Manufacturing printed circuit boards using uv free radical curable inkjet inks19 Jul 2018US 2018/0206342 A1Agfa-Gevaert
- Double-sided circuit substrate suitable for high-frequency circuits10 Aug 2017US 2017/0231088 A1Daikin Industries, Ltd.
- Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured thereby9 Jun 2016US 2016/0165721 A1Amogreentech Co., Ltd.
- Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit7 Jan 2016US 2016/0007477 A1DIC Corporation
Most cited
By later US patents
- Lamination of fluorocarbon films31US 4,549,921 AE. I. Du Pont de Nemours and Company · 1985
- Flame-proof flexible printed circuit board30US 4,311,749 ANippondenso Co., Ltd. · 1982
- Polyimide film having improved adhesive properties15US 4,755,424 AKanegafuchi Kagaku Kogyo Kabushiki Kaisha · 1988
- Method for transferring ink by printing method14US 5,693,375 ANippon Oil Co., Ltd. · 1997
- Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface8US 7,851,344 B2Seiko Epson Corporation · 2010