Double-sided circuit substrate suitable for high-frequency circuits
AssigneesNippon Kayaku Kabushiki Kaisha, Daikin Industries, Ltd.
InventorsYasumasa AKATUKA, Shigeru MOTEKI, Hirokazu KOMORI, Takeshi INABA
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Abstract
Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.
Claims13
A double-sided circuit substrate which is a laminate of a composite material comprising a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) and a glass cloth, and a copper foil having a two-dimensional roughness Ra on the matte side (side in contact with the resin) of less than 0.2 μm,
- wherein the matte side of the copper foil is in contact with the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) of the composite material.
A double-sided circuit substrate comprising n sheets of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films and n−1 sheet(s) of glass cloth(s) alternately laminated between two copper foils (n is an integer of 2 or larger and 10 or smaller),
- wherein the copper foils have a two-dimensional roughness Ra on the matte side (side in contact with the resin) of less than 0.2 μm,
- wherein the two copper foils are in contact with the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films.
(canceled)
Dependencies are inferred from the claim text.