Polyimide film having improved adhesive properties
AssigneeKanegafuchi Kagaku Kogyo Kabushiki Kaisha
InventorsYoshiki Takeoka, Hideki Kawai, Tsuneo Yamamoto
Life of this patent
Estimating the term…
Abstract
A polyimide film produced by forming a film from a raw material incorporated with a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll.
Claims3
A polyimide film produced by forming a polyimide film having a thickness of 7.5 to 125 .mu.m from a raw material incorporated with a finely divided inorganic powder having a particle size of 1 to 5 .mu.m that forms minute projections on the surface of the formed film, and subsequently subjecting the formed film to a corona discharge treatment.
Dependencies are inferred from the claim text.