Hydrophilic treatment method and wiring pattern forming method

A wiring pattern forming method comprising:

• forming a mask layer made of a resin on a metallic film formed on the entirety of a surface of one side of a resin substrate;
• subsequently performing patterning on said mask layer to thereby form groove portions each having a bottom surface, from which said metallic film is exposed, according to a wiring pattern to be formed;
• subsequently performing a plasma treatment on a surface of one side of said resin substrate, in which said groove portions are formed, at atmospheric pressure in an atmosphere containing a hydrophilic gas that has a hydrophilic group and which gas is selected from the group consisting of an alcohol, an organic matter having a carboxylic group, and combinations thereof;
• and
• subsequently performing electrolytic plating using said metallic film an electric power supplying layer so that said groove portions are filled with metal to thereby form a wiring pattern.

A hydrophilic treatment method, comprising:

• providing a molded article made of a resin;
• performing a corona discharge treatment on the molded article;
• after performing the corona discharge treatment, performing a plasma treatment on the molded article to impart hydrophilicity;
• wherein when hydrophilicity is imparted to said molded article, the plasma treatment is performed at atmospheric pressure in an atmosphere containing a hydrophilic gas that has a hydrophilic group and which gas is selected from the group consisting of an alcohol, an organic matter having a carboxylic group, and combinations thereof.