Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured thereby

A method for manufacturing a flexible printed circuit board, comprising:

• preliminarily thermally deforming a substrate through heating;
• forming a via hole in the substrate;
• filling the via hole with a conductive paste;
• laminating a carrier on a second surface of the substrate between forming the via hole and filling the via hole;
• forming a first circuit pattern with a conductive paste on a first surface of the preliminarily thermally deformed substrate;
• firing the first circuit pattern;
• forming a protective coating layer for protecting the first circuit pattern by applying a coating solution on a the first surface of the substrate after firing the first circuit pattern;
• removing the carrier from the second surface of the substrate after forming the first circuit pattern on the first surface of the substrate;
• laminating the carrier on the first surface of the substrate before forming a second circuit pattern;
• forming the second circuit pattern with a conductive paste on the second surface of the substrate;
• then removing the carrier from the first surface of the substrate after forming the second circuit pattern;
• forming an additional circuit pattern with a conductive paste on the protective coating layer;
• and firing the additional circuit pattern.