H05K 2203/092
Particle beam
Official title: Particle beam, e.g. using an electron beam or an ion beam
H05K2203/092 (Particle beam) appears on 78 US grants and 98 published applications in this corpus.
Search patents in H05K- Granted patents
- 78
- Published applications
- 98
- Assignees
- 75
- Inventors
- 252
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 2 |
| 2005 | 2 | 3 |
| 2006 | 0 | 8 |
| 2007 | 2 | 5 |
| 2008 | 0 | 5 |
| 2009 | 3 | 3 |
| 2010 | 6 | 6 |
| 2011 | 4 | 3 |
| 2012 | 0 | 2 |
| 2013 | 1 | 3 |
| 2014 | 4 | 6 |
| 2015 | 3 | 8 |
| 2016 | 3 | 4 |
| 2017 | 4 | 5 |
| 2018 | 4 | 4 |
| 2019 | 4 | 4 |
| 2020 | 7 | 7 |
| 2021 | 3 | 6 |
| 2022 | 6 | 3 |
| 2023 | 2 | 2 |
| 2024 | 2 | 0 |
| 2025 | 0 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board31 Dec 2024US 12,185,477 B2Ajinomoto Co., Inc.
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor27 Feb 2024US 11,917,768 B2Richview Electronics Co., Ltd.
- Electrostatic trap mass spectrometer with improved ion injection29 Aug 2023US 11,742,192 B2Leco Corporation
- Microwave dielectric component and manufacturing method thereof10 Jan 2023US 11,552,617 B2Richview Electronics Co., Ltd.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
- Component Carrier, Method and Apparatus for Manufacturing the Component Carrier13 Nov 2025US 2025/0351268 A1AT&S (Chongqing) Company Limited
- Semiconductor package and method of manufacturing the same29 May 2025US 2025/0176111 A1Samsung Electronics Co., Ltd.
- Semiconductor nanoparticle composite film, composite base and device including the same, and method for manufacturing semiconductor nanoparticle composite film3 Apr 2025US 2025/0109022 A1Osaka University
Most cited
By later US patents
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Method for forming electrically conductive paths58US 4,159,414 AMassachusetts Institute of Technology · 1979
- Recessed metallurgy for dielectric substrates39US 3,956,052 AInternational Business Machines Corporation · 1976
- Method of making dimensionally stable composite article37US 6,858,253 B23M Innovative Properties Company · 2005
- Method for manufacturing a circuit board36US 4,710,253 ASomich Technology Inc. · 1987