Recessed metallurgy for dielectric substrates
AssigneeInternational Business Machines Corporation
InventorsWalter W. Koste, Ernest N. Urfer
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Abstract
A ceramic green sheet material is metallized by laminating a thin organic material, preferably MYLAR, to a ceramic green sheet surface, and then employing an electron beam to define a predetermined pattern of openings extending through the organic material and selectively into and through the green sheet. The resulting channels and via holes are then filled with a metal paste. The organic mask is removed by peeling subsequent to the metal paste deposition step.
Claims1
A method of depositing on a dielectric substrate recessed metallized interconnection channels and metallized vertical via conductive paths comprising the steps of:
- a. laminating an organic masking layer onto a dielectric substrate;
- b. thermally machining interconnection channels and vertical via paths through said masking layer into said dielectric substrate and simultaneously forming said organic masking layer into a self-registered mask, said mask having openings of substantially identical planar geometry to that of the underlying interconnection channels and vertical via paths;
- c. coating a metallic conductive material through said mask openings into said recessed interconnection channels and vertical via paths;
- d. and peeling away said organic masking layer from said dielectric substrate, whereby said dielectric substrate has said recessed metallized interconnection channels and metallized vertical via paths formed therein.
Dependencies are inferred from the claim text.