Method for manufacturing a circuit board
AssigneeSomich Technology Inc.
InventorPeter Soszek
Life of this patent
Estimating the term…
Abstract
A circuit board is manufactured by applying a film of heat actuable adhesive to a substrate and depositing on the film a layer of a conductive powder. The powder and film are then activated by laser radiation or by direct contact with a heated plate. The excess powder is then removed and the substrate fired to cure or bond the powder to the substrate while removing excess adhesive film.
Claims15
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, applying a layer of a heat actuable adhesive to said surface, loosely dispensing onto said layer an electrically conductive powder consisting of elemental metal in such a manner that the powder remains unbonded to the surface and can be readily removed therefrom, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive without affecting the powder to adhesively bond said powder to said surface in said pattern, and removing from said surface powder which remains unbonded.
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, loosely dispensing onto said surface a powder in such a manner that the powder remains unbonded to the surface and can readily be removed therefrom, said powder consisting of a mixture of a heat actuable adhesive powder and an electrically conductive elemental metal powder, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive powder without affecting said metal powder to bond said metal powder to said surface in said pattern, and removing from said surface said powder which remains unbonded.
Dependencies are inferred from the claim text.