H05K 2203/088
Using a vapour or mist
Official title: Using a vapour or mist, e.g. cleaning using water vapor
H05K2203/088 (Using a vapour or mist) appears on 43 US grants and 25 published applications in this corpus.
Search patents in H05K- Granted patents
- 43
- Published applications
- 25
- Assignees
- 39
- Inventors
- 102
- Latest grant
- 24 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 3 | 2 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 4 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 1 |
| 2019 | 1 | 3 |
| 2020 | 3 | 2 |
| 2021 | 2 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board24 Dec 2024US 12,177,972 B2Nof Corporation
- Copper foil with carrier19 Sep 2023US 11,765,840 B2Mitsui Mining & Smelting Co., Ltd.
- Method of restricting micro device on conductive pad20 Apr 2021US 10,986,737 B2Mikro Mesa Technology Co., Ltd.
- Method of liquid assisted binding23 Mar 2021US 10,959,336 B2Mikro Mesa Technology Co., Ltd.
- Mixing dimers for moisture resistant materials11 Aug 2020US 10,743,421 B2
- Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board8 Aug 2024US 2024/0268022 A1Nof Corporation
- Copper foil with carrier25 Feb 2021US 2021/0059057 A1Mitsui Mining & Smelting Co., Ltd.
- Method of liquid assisted binding1 Oct 2020US 2020/0315028 A1Mikro Mesa Technology Co., Ltd.
- Method of restricting micro device on conductive pad1 Oct 2020US 2020/0315029 A1Mikro Mesa Technology Co., Ltd.
- Flexible circuit board incorporating sunken resistor and method for manufacturing same27 Jun 2019US 2019/0200464 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Cleaning and drying of electronic assemblies68US 5,055,138 AI.S. C. Chemicals Limited · 1991
- Two tank cleaning process using a contaminated cleaning mixture capable of forming an azeotrope42US 3,957,531 AImperial Chemical Industries PLC · 1976
- Method for producing a multilayer ceramic circuit board41US 4,642,148 AFujitsu Limited · 1987
- Method and apparatus for CO.sub.2 cleaning with mitigated ESD38US 5,651,834 ALucent Technologies Inc. · 1997
- Cleaning and drying of electronic assemblies35US 5,183,067 AI.S. C. Chemicals Limited · 1993