Method of restricting micro device on conductive pad
AssigneeMikro Mesa Technology Co., Ltd.
InventorLi-Yi Chen
Life of this patent
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Abstract
A method of restricting a micro device on a conductive pad is provided. The method includes: forming the conductive pad having a first lateral length on a substrate; forming a liquid layer on the conductive pad; and placing the micro device having a second lateral length over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, the micro device comprising an electrode facing the conductive pad, wherein the first lateral length is less than or equal to twice of the second lateral length.
Claims12
A method of restricting a micro device on a conductive pad, comprising:
- forming the conductive pad having a first lateral length on a substrate;
- forming a liquid layer on the conductive pad;
- and
- placing the micro device having a second lateral length less than or equal to about 100 μm over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, the micro device comprising an electrode facing the conductive pad, wherein the first lateral length is less than or equal to twice of the second lateral length.
Dependencies are inferred from the claim text.