Copper foil with carrier
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsRintaro Ishii, Takenori Yanai, Yoshinori Matsuura
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Abstract
An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.
Claims20
A copper foil with a carrier, comprising:
- a carrier;
- an intermediate layer provided on the carrier;
- a release layer provided on the intermediate layer, the release layer comprising a metal oxide sublayer and a carbon sublayer;
- and
- an extremely thin copper layer provided on the release layer,
- wherein the intermediate layer comprises
- a Ti-containing sublayer adjoining the carrier and
- a Cu-containing sublayer adjoining the release layer, and
- wherein the metal oxide sublayer is a copper oxide layer.
A copper foil with a carrier, comprising:
- a carrier;
- an intermediate layer provided on the carrier;
- a release layer provided on the intermediate layer, the release layer comprising a metal oxide sublayer and a carbon sublayer;
- and
- an extremely thin copper layer provided on the release layer,
- wherein the intermediate layer is an Al-containing layer and the metal oxide sublayer is an aluminum oxide layer.
Dependencies are inferred from the claim text.