Method of liquid assisted binding
AssigneeMikro Mesa Technology Co., Ltd.
InventorLi-Yi Chen
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Abstract
A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.
Claims20
A method of liquid assisted binding, comprising:
- forming a conductive pad on a substrate;
- placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad, wherein the micro device comprises an electrode facing the conductive pad;
- forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer;
- and
- evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.
Dependencies are inferred from the claim text.