H05K 2203/0793
Aqueous alkaline solution
Official title: Aqueous alkaline solution, e.g. for cleaning or etching
H05K2203/0793 (Aqueous alkaline solution) appears on 193 US grants and 138 published applications in this corpus.
Search patents in H05K- Granted patents
- 193
- Published applications
- 138
- Assignees
- 136
- Inventors
- 582
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 7 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 12 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 4 | 2 |
| 2002 | 6 | 6 |
| 2003 | 3 | 4 |
| 2004 | 4 | 8 |
| 2005 | 1 | 6 |
| 2006 | 4 | 12 |
| 2007 | 2 | 7 |
| 2008 | 2 | 10 |
| 2009 | 2 | 9 |
| 2010 | 7 | 7 |
| 2011 | 3 | 3 |
| 2012 | 3 | 3 |
| 2013 | 1 | 5 |
| 2014 | 0 | 5 |
| 2015 | 3 | 5 |
| 2016 | 5 | 4 |
| 2017 | 4 | 4 |
| 2018 | 5 | 8 |
| 2019 | 5 | 7 |
| 2020 | 6 | 10 |
| 2021 | 4 | 1 |
| 2022 | 3 | 4 |
| 2023 | 4 | 1 |
| 2024 | 0 | 3 |
| 2025 | 1 | 3 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Insulating circuit board and semiconductor device in which same is used24 Feb 2026US 12,563,665 B2Niterra Materials Co., Ltd.
- Chemical solution used for cleaning or etching ruthenium-containing layer and method for fabricating ruthenium wiring7 Jan 2025US 12,187,943 B2Tokyo Ohka Kogyo.Co., Ltd.
- Method for assembling components implementing a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering26 Dec 2023US 11,855,038 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Insulating circuit board and semiconductor device in which same is used4 Jun 2026US 2026/0156744 A1Niterra Materials Co., Ltd.
- Method for cleaning a nonconductive surface and use16 Oct 2025US 2025/0324516 A1Atotech Deutschland GmbH
- Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor18 Sep 2025US 2025/0290205 A1
- Composite film, rigid flexible printed circuit board, and electronic device including same3 Apr 2025US 2025/0113442 A1Samsung Electronics Co., Ltd.
- Modified copper surface, heteroaromatic silane compounds and their usage for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation30 May 2024US 2024/0179851 A1Atotech Deutschland GmbH
Most cited
By later US patents
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999
- Flexible circuit electrode array and method of manufacturing the same83US 7,877,866 B1Second Sight Medical Products, Inc. · 2011
- Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions62US 4,425,380 AKollmorgen Technologies Corporation · 1984
- Flexible circuit laminate and method of making the same55US 4,634,631 ARogers Corporation · 1987
- Through-hole plating45US 4,515,829 AShipley Company, L.L.C. · 1985