H05K 2203/0537
Transfer of pre-fabricated insulating pattern
H05K2203/0537 (Transfer of pre-fabricated insulating pattern) appears on 91 US grants and 70 published applications in this corpus.
Search patents in H05K- Granted patents
- 91
- Published applications
- 70
- Assignees
- 64
- Inventors
- 199
- Latest grant
- 8 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 3 | 4 |
| 2004 | 3 | 6 |
| 2005 | 2 | 2 |
| 2006 | 3 | 4 |
| 2007 | 3 | 2 |
| 2008 | 1 | 11 |
| 2009 | 1 | 11 |
| 2010 | 4 | 3 |
| 2011 | 5 | 1 |
| 2012 | 2 | 3 |
| 2013 | 4 | 1 |
| 2014 | 5 | 5 |
| 2015 | 3 | 5 |
| 2016 | 2 | 2 |
| 2017 | 5 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laminator8 Apr 2025US 12,274,009 B2Doosan Corporation
- Resin film10 Dec 2024US 12,162,245 B2Airbus Operations GmbH
- Ceramic substrate and method for manufacturing ceramic substrate4 May 2021US 10,999,927 B2Murata Manufacturing Co., Ltd.
- Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a method for producing stretchable electrode arrays and/or stretchable conductive paths in general15 Oct 2019US 10,448,514 B2Ecole Polytechnique Federale De Lausanne (Epfl)
- Dry film and printed wiring board21 Nov 2017US 9,822,226 B2Taiyo Ink Mfg. Co., Ltd.
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Resin film11 Jul 2024US 2024/0227360 A9Airbus Operations GmbH
- Resin film25 Apr 2024US 2024/0131820 A1Airbus Operations GmbH
- A method and a system for generating a high-resolution pattern on a substrate14 Dec 2023US 2023/0399736 A1Teknologian tutkimuskeskus VTT Oy
- Laminator16 Feb 2023US 2023/0049939 A1Doosan Corporation
Most cited
By later US patents
- Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards75US 6,622,380 B1Micron Technology, Inc. · 2003
- Method and apparatus for attaching particles to a substrate61US 6,080,650 ATexas Instruments Incorporated · 2000
- Method of making solderable printed circuits formed without plating52US 5,045,141 AAmoco Corporation · 1991
- Method including treatment of ink on a plate to cause hardening at other than the ink outer surface before printing48US 5,127,330 ADai Nippon Insatsu Kabushiki Kaisha · 1992
- Pre-patterned circuit board device-attach adhesive transfer system47US 4,959,008 ANational Starch and Chemical Investment Holding Corporation · 1990