Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a method for producing stretchable electrode arrays and/or stretchable conductive paths in general

A method, comprising:

• forming a soft or rubber material layer on a rigid support carrier
• forming a conductive path on said soft or rubber material layer;
• forming an encapsulation layer on a substrate, wherein said substrate comprises a transparent carrier;
• forming at least one through via through said encapsulation layer;
• aligning said at least one through via with a predefined portion of said conductive path;
• reciprocally bonding said encapsulation layer and said support carrier;
• removing said transparent carrier after reciprocally bonding said encapsulation layer and said support carrier;
• forming a silicone rubber layer on said transparent carrier;
• forming said encapsulation layer on said silicone rubber layer;
• and
• peeling off said silicone rubber layer from said encapsulation layer after reciprocally bonding said encapsulation layer and said support carrier.