A method and a system for generating a high-resolution pattern on a substrate

An apparatus for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate, the apparatus comprising:

• a roller provided with a semi-dry polymer ink film on top of a polydimethylsiloxane surface disposed on its outer surface;
• a three-dimensional relief pattern configured to produce a patterned polymer ink film having a form of a negative of the desired pattern defined by first portions of the semi-dry polymer ink film remaining on top of the polydimethylsiloxane surface on the roller, when the three-dimensional relief pattern is configured to be temporarily brought into contact with the semi-dry polymer ink film so that second portions of the semi-dry polymer ink film are transferred to the three-dimensional relief pattern, wherein fracturing of the semi-dry polymer ink film at the edges of the three-dimensional relief pattern is configured to cause the patterned polymer ink film to have vertical sidewalls, wherein the fracturing is caused by cohesion of the semi-dry polymer ink film and adhesion between the semi-dry polymer ink and the three-dimensional relief pattern;
• wherein the roller is further configured be brought into contact with a substrate for transferring the patterned polymer ink film from the polydimethylsiloxane surface onto the substrate to produce a negative of the desired pattern on the substrate, wherein the negative of the desired pattern on the substrate has said vertical sidewalls;
• physical deposition means, such as resistive evaporation, thermal evaporation, e-beam evaporation, pulsed laser deposition, sublimation or sputtering means, or chemical deposition means, such as atomic layer deposition means, for depositing a conductive, semi-conductive or insulating material layer onto the face of the substrate with the negative of the desired pattern;
• and
• dissolving means configured to introduce an organic solvent on the substrate with the vacuum deposited material layer for dissolving the negative of the desired pattern to yield the desired pattern formed by the deposited conductive, semi-conductive or insulating material on the substrate.