Method and apparatus for attaching particles to a substrate
AssigneeTexas Instruments Incorporated
InventorDarvin R. Edwards
Life of this patent
Estimating the term…
Abstract
A method for attaching particles (12) to a substrate (14), comprising the steps of transferring adhesive areas (30) from an adhesive stamp (35) to contact pads (42) of the substrate (14), and depositing the particles (12) onto the adhesive areas (30) on the contact pads (42), thereby attaching the particles (12) to the substrate (14). The adhesive stamp (35) may comprise a stamp (20) having at least one projection (22) and an adhesive material applied thereon. The stamp (20) may be composed of silicon, silicone rubber or metal. The adhesive material may be composed of an adhesive polymer or an adhesive flux.
Claims8
A method for attaching a particle to a substrate, comprising the steps of:
- transferring adhesive material from an adhesive stamp to a contact pad of the substrate;
- and
- loading the particle onto the contact pad having adhesive material deposited thereon, thereby attaching the particle to the substrate.
A method for attaching solder particles to a substrate, comprising the steps of:
- obtaining an adhesive stamp having a plurality of adhesive areas;
- aligning said plurality of adhesive areas with contact pads of the substrate;
- transferring said plurality of adhesive areas to said contact pads;
- applying thermal energy to said plurality of adhesive areas;
- depositing the solder particles onto the substrate, whereby each adhesive area captures one particle;
- then removing the excess solder particles not captured by said adhesive;
- and then
- securely attaching the captured solder particles to said contact pads.
Dependencies are inferred from the claim text.