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US 10,999,927 B2Granted
Ceramic substrate and method for manufacturing ceramic substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorYosuke Mino
Life of this patent
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Abstract
A ceramic substrate according to the present disclosure includes a plurality of electrodes on an electronic component mounting surface, and one or more interelectrode wires that connect the electrodes to each other on the electronic component mounting surface. A resist that extends across the interelectrode wire is disposed on the electronic component mounting surface.
Claims4
A ceramic substrate comprising:
- a plurality of electrodes on an electronic component mounting surface;
- and
- one or more interelectrode wires each connecting the electrodes to each other on the electronic component mounting surface,
- wherein a resist extending across an interelectrode wire is disposed on the electronic component mounting surface, wherein the interelectrode wire is bent downward to be laid deeper than two electrodes that are connected by the interelectrode wire, and
- wherein the resist is embedded in the interelectrode wire where the resist is extending across the interelectrode wire.
2 more elements
Dependencies are inferred from the claim text.