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US 9,822,226 B2Granted
Dry film and printed wiring board
AssigneeTaiyo Ink Mfg. Co., Ltd.
InventorsTakayuki Chujo, Arata Endo
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.
Claims19
A dry film, comprising:
- a resin layer comprising a thermosetting resin component, a filler and a plurality of solvents,
- wherein the solvents each have a boiling point of 100° C. or higher, the solvents have boiling points which are different by not less than 5° C., and the solvents are ones selected from the group consisting of toluene, cyclohexanone, and an aromatic hydrocarbon having 8 or more carbon atoms.
Dependencies are inferred from the claim text.