H05K 2203/0525
Patterning by phototackifying or by photopatterning adhesive
H05K2203/0525 (Patterning by phototackifying or by photopatterning adhesive) appears on 47 US grants and 30 published applications in this corpus.
Search patents in H05K- Granted patents
- 47
- Published applications
- 30
- Assignees
- 22
- Inventors
- 77
- Latest grant
- 8 Dec 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 4 |
| 2003 | 2 | 4 |
| 2004 | 2 | 4 |
| 2005 | 2 | 3 |
| 2006 | 2 | 1 |
| 2007 | 2 | 1 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 2 | 3 |
| 2011 | 0 | 3 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same8 Dec 2020US 10,858,475 B2Nitto Denko Corporation
- Method and installation for producing a multilayer element and multilayer element19 Mar 2019US 10,237,984 B23D-Micromac AG
- Composition for forming adhesive pattern, laminated structure obtained by using same, and method of producing such laminated structure9 Nov 2010US 7,829,180 B2Taiyo Ink Mfg. Co., Ltd.
- Process for thick film circuit patterning22 Jun 2010US 7,741,013 B2E. I. Du Pont de Nemours and Company
- Binder diffusion transfer patterning of a thick film paste layer15 Apr 2008US 7,358,037 B2E. I. Du Pont de Nemours and Company
- Interposer and method of forming the same7 Aug 2025US 2025/0251667 A1Hygon Information Technology Co., Ltd.
- Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same12 Oct 2017US 2017/0291984 A1Nitto Denko Corporation
- Printable Films for Printed Circuit Boards and Processes for Making Same11 May 2017US 2017/0135220 A1The Governing Council of the University of Toronto
- Method and system for producing a multilayer element and multilayer element28 May 2015US 2015/0144379 A13D-Micromac AG
- Method for producing multilayer wiring substrate and multilayer wiring substrate13 Oct 2011US 2011/0247865 A1FUJIFILM Corporation
Most cited
By later US patents
- Process for coating surfaces made tacky beforehand93US 5,167,989 AE. I. Du Pont de Nemours and Company · 1992
- Polymeric sensitizers for photopolymer composition80US 4,565,769 AE. I. Du Pont de Nemours and Company · 1986
- Use of photosensitive stratum to create through-hole connections in circuit boards42US 4,360,570 AE. I. Du Pont de Nemours and Company · 1982
- Preparation of photoformed plastic multistrate by via formation first41US 4,572,764 AE. I. Du Pont de Nemours and Company · 1986
- Method for making multilayer circuits using embedded catalyst receptors34US 4,737,446 AE. I. Du Pont de Nemours and Company · 1988