Printable Films for Printed Circuit Boards and Processes for Making Same
AssigneeThe Governing Council of the University of Toronto
InventorsPerumal Varun Chadalavada, Daniel Wigdor
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AssigneeThe Governing Council of the University of Toronto
InventorsPerumal Varun Chadalavada, Daniel Wigdor
Estimating the term…
Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.
A film for use in the preparation of a printed circuit board (PCB), comprising:
A method of creating a printed circuit board (PCB), comprising:
A method of producing a printable film for use in the preparation of a printed circuit board, comprising:
Dependencies are inferred from the claim text.