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US 7,358,037 B2Granted
Binder diffusion transfer patterning of a thick film paste layer
AssigneeE.I. du Pont de Nemours and Company
InventorLap-Tak Andrew Cheng
Life of this patent
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Abstract
The present invention concerns a process for the fabrication of electrical and electronic devices. A polymer film is patterned on a substrate. A thick film paste is deposited over the patterned polymer. The thick film paste is dried under conditions which allow diffusion of the polymer into the thick film paste. This renders the diffused area insoluble in alkaline development solution.
Claims16
A process for depositing on a substrate a thick film paste composition that comprises a solvent, comprising
- (a) providing on the substrate a patterned layer of a polymer that is soluble in the solvent,
- (b) depositing the thick film paste composition on the patterned layer,
- (c) dissolving polymer with the solvent to diffuse polymer into the thick film paste composition, and
- (d) removing any thick film paste composition into which polymer has not diffused.
1 more element
Dependencies are inferred from the claim text.