Method and installation for producing a multilayer element and multilayer element
Assignee3D-Micromac AG
InventorsTino Petsch, Maurice Clair, Alexander Böhm, Martin Sachse
Life of this patent
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Abstract
A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.
Claims12
A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions comprising:
- connecting a conductor foil to the substrate such that the conductor foil fully connects to the substrate in the first regions and a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones in laterally extended second regions;
- structuring the conductor foil by cutting the conductor foil along boundaries of the first regions so that, after cutting, contiguous pieces of foil are still attached to the substrate in the regions of the bonding zones;
- and
- removing contiguous pieces of foil of the conductor foil from the laterally extended second regions by releasing the partial bonding contact between the substrate and the conductor foil;
- wherein the conductor foil connects to the substrate by a layer of adhesive lying in between, and
- wherein, before connecting the conductor foil to the substrate, in a first partial operation a layer of adhesive is applied to the substrate or the conductor foil over the full surface area in first and second regions, and after that, in a second partial operation, intermediate regions of the layer of adhesive with reduced bonding force or without any bonding force, are thereby created by a post-treatment within the laterally extended second regions between the bonding zones provided.
A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions comprising:
- connecting a conductor foil to the substrate such that the conductor foil fully connects to the substrate in the first regions and a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones in laterally extended second regions;
- structuring the conductor foil by cutting the conductor foil along boundaries of the first regions so that, after cutting, contiguous pieces of foil are still attached to the substrate in the regions of the bonding zones;
- and
- removing contiguous pieces of foil of the conductor foil from the laterally extended second regions by releasing the partial bonding contact between the substrate and the conductor foil;
- wherein the conductor foil connects to the substrate by a layer of adhesive lying in between, and
- wherein, before connecting the conductor foil to the substrate, a laterally structured layer of adhesive is applied to the substrate or to the conductor foil, adhesive material being applied over a full surface area in the first regions and partially, in accordance with a prescribed pattern, in laterally extended second regions, to create the bonding zones, by a jet printing process, a flexographic printing process, a screen printing process, an offset printing process, a slot-die coating process or an intaglio printing process.
A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions comprising:
- connecting a conductor foil to the substrate such that the conductor foil fully connects to the substrate in the first regions and a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones in laterally extended second regions;
- structuring the conductor foil by cutting the conductor foil along boundaries of the first regions so that, after cutting, contiguous pieces of foil are still attached to the substrate in the regions of the bonding zones;
- and
- removing contiguous pieces of foil of the conductor foil from the laterally extended second regions by releasing the partial bonding contact between the substrate and the conductor foil,
- wherein the conductor foil connects to the substrate by a layer of adhesive lying in between, and
- the adhesive layer is created such that the bonding zones in laterally extended second regions form a pattern of points or a pattern of lines and/or such that an area fraction of the bonding zones within the laterally extended second regions is 2% to 80%.
A multilayer element produced by a method comprising:
- connecting a conductor foil to a substrate such that the conductor foil fully connects to the substrate in first regions and a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones in laterally extended second regions;
- structuring the conductor foil by cutting the conductor foil along boundaries of the first regions so that, after cutting, contiguous pieces of foil are still attached to the substrate in the regions of the bonding zones;
- and
- removing contiguous pieces of foil of the conductor foil from the laterally extended second regions by releasing the partial bonding contact between the substrate and the conductor foil,
- wherein the substrate and at least one conductor structure connected in an areal manner to the substrate by a layer of adhesive, the at least one conductor structure having first regions of electrically conductive material present on the layer of adhesive in accordance with a prescribed pattern, while electrically non-conductive second regions lie adjacent to first regions, while a multiplicity of bonding zones of the layer of adhesive are present in a distributed manner in accordance with a prescribed pattern in laterally extended second regions, the bonding zones in laterally extended second regions forming a pattern of points or a pattern of lines and/or wherein an area fraction of the bonding zones within the laterally extended regions of 2% to 80%.
Dependencies are inferred from the claim text.