H05K 2201/2018
Presence of a frame in a printed circuit or printed circuit assembly
H05K2201/2018 (Presence of a frame in a printed circuit or printed circuit assembly) appears on 520 US grants and 627 published applications in this corpus.
Search patents in H05K- Granted patents
- 520
- Published applications
- 627
- Assignees
- 332
- Inventors
- 1,376
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 11 |
| 2002 | 14 | 16 |
| 2003 | 12 | 20 |
| 2004 | 13 | 14 |
| 2005 | 11 | 11 |
| 2006 | 12 | 37 |
| 2007 | 15 | 25 |
| 2008 | 15 | 41 |
| 2009 | 19 | 39 |
| 2010 | 29 | 33 |
| 2011 | 21 | 24 |
| 2012 | 25 | 13 |
| 2013 | 16 | 20 |
| 2014 | 12 | 23 |
| 2015 | 19 | 29 |
| 2016 | 21 | 20 |
| 2017 | 22 | 25 |
| 2018 | 25 | 27 |
| 2019 | 35 | 34 |
| 2020 | 27 | 38 |
| 2021 | 30 | 29 |
| 2022 | 26 | 31 |
| 2023 | 17 | 28 |
| 2024 | 26 | 20 |
| 2025 | 16 | 8 |
| 2026 | 14 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Vacuum-based attachment for heat sink and radiation shield9 Jun 2026US 12,652,786 B2Intel Corporation
- Drive and control integrated board, control system, and robot2 Jun 2026US 12,648,083 B2Qkm Technology (Dong Guan) Co., Ltd
- Power supply module19 May 2026US 12,633,443 B2Delta Electronics (Shanghai) Co., Ltd.
- Conductive module12 May 2026US 12,628,279 B2Yazaki Corporation
- Wearable electronic device comprising rigid flexible printed circuit board3 Sep 2026US 2026/0259581 A1Samsung Electronics Co., Ltd.
- Electronic assembly20 Aug 2026US 2026/0246182 A1Wistron Corporation
- Fixing device and electronic equipment18 Jun 2026US 2026/0173270 A1Fulian Precision Electronics (Tianjin) Co., LTD.
- Insulated metal substrate and method for producing an insulated metal substrate30 Apr 2026US 2026/0122772 A1Hitachi Energy Ltd
- Printed circuit board2 Apr 2026US 2026/0096017 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Semiconductor package using terminals formed on a conductive layer of a circuit board258US 6,040,622 ASanDisk Corporation · 2000
- Robotic surgical system with local sensing of functional parameters based on measurements of multiple physical inputs249US 11,376,082 B2Cilag GmbH International · 2022
- Panel stacking of BGA devices to form three-dimensional modules239US 6,404,043 B1Dense-Pac Microsystems, Inc. · 2002
- Instrument drive units235US 10,736,219 B2Covidien LP · 2020
- High density memory module using stacked printed circuit boards177US 7,254,036 B2Netlist, Inc. · 2007