Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong MIN, Jong Eun PARK
Life of this patent
Estimating the term…
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong MIN, Jong Eun PARK
Estimating the term…
The present disclosure relates to a printed circuit board including: a glass layer having upper and lower surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and third and fourth side surfaces opposing each other in a third direction, and configured to reinforce at least a portion of an edge region adjacent to each of the first to fourth side surfaces, and configured not to reinforced at least a portion of an inner region surrounded by the edge region; a first insulating material covering at least portions of the first to fourth side surfaces of the glass layer; and second and third insulating materials covering at least a portion of each of the upper surface and the lower surface of the glass layer and extending to an upper side and a lower side of the first insulating material, respectively.
A printed circuit board, comprising:
A printed circuit board, further comprising:
A printed circuit board, comprising:
Dependencies are inferred from the claim text.