H05K 2201/10477
Inverted
H05K2201/10477 (Inverted) appears on 233 US grants and 152 published applications in this corpus.
Search patents in H05K- Granted patents
- 233
- Published applications
- 152
- Assignees
- 149
- Inventors
- 491
- Latest grant
- 13 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 0 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 15 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 14 | 6 |
| 2002 | 8 | 11 |
| 2003 | 16 | 16 |
| 2004 | 7 | 6 |
| 2005 | 4 | 13 |
| 2006 | 7 | 11 |
| 2007 | 8 | 14 |
| 2008 | 6 | 16 |
| 2009 | 5 | 12 |
| 2010 | 10 | 8 |
| 2011 | 14 | 11 |
| 2012 | 6 | 6 |
| 2013 | 3 | 7 |
| 2014 | 7 | 2 |
| 2015 | 3 | 5 |
| 2016 | 3 | 2 |
| 2017 | 2 | 0 |
| 2018 | 1 | 1 |
| 2019 | 0 | 1 |
| 2020 | 2 | 2 |
| 2021 | 0 | 0 |
| 2022 | 2 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lighting fixture with reflector and template PCB13 Sep 2022US 11,441,747 B2IDEAL Industries Lighting LLC
- Component carrier with embedded component having pads connected in different wiring layers1 Feb 2022US 11,240,914 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Methods and devices associated with bonding of solid-state lithium batteries22 Dec 2020US 10,873,102 B2Verily Life Sciences LLC
- Lighting fixture with reflector and template PCB29 Sep 2020US 10,788,177 B2IDEAL Industries Lighting LLC
- Methods and devices associated with bonding of solid-state lithium batteries5 Jun 2018US 9,991,550 B2Verily Life Sciences LLC
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Thermal management for flat no lead packages14 Mar 2024US 2024/0090131 A1Hamilton Sundstrand Corporation
- Lighting fixture with reflector and template pcb24 Dec 2020US 2020/0400279 A1IDEAL Industries Lighting LLC
- Component Carrier With Embedded Component Having Pads Connected in Different Wiring Layers26 Mar 2020US 2020/0100365 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Base board and mobile terminal31 Jan 2019US 2019/0037701 A1
Most cited
By later US patents
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Method for connecting packages of a stacked ball grid array structure229US 5,783,870 ANational Semiconductor Corporation · 1998
- Multi-feature-size electronic structures227US 6,606,247 B2Alien Technology Corporation · 2003
- Electronic devices with small functional elements supported on a carrier194US 6,816,380 B2Alien Technology Corporation · 2004