Thermal management for flat no lead packages
AssigneeHamilton Sundstrand Corporation
InventorsAlexander Trotman, Judy Schwartz
Life of this patent
Estimating the term…
Abstract
A method of forming a circuit board assembly includes receiving a flat no-lead package. The package includes: a housing having a first side and second side; a circuit disposed within the housing; and an exposed thermal belly pad that is thermally coupled to the circuit and passes at least partially through the first side such that it can be exposed to an environment outside of the housing. The method also includes attaching the second side of the flat no-lead package to a first side of a printed circuit board (PCB) such that the exposed thermal belly pad is opposite the first side of the PCB.
Claims15
A method of forming a circuit board assembly, the method comprising:
- receiving a flat no-lead package, wherein the package includes:
- a housing having a first side and second side;
- a circuit disposed within the housing;
- and an exposed thermal belly pad that is thermally coupled to the circuit and passes at least partially through the first side such that it can be exposed to an environment outside of the housing;
- and
- attaching the second side of the flat no-lead package to a first side of a printed circuit board (PCB) such that the exposed thermal belly pad is opposite the first side of the PCB.
A circuit board assembly comprising:
- a flat no-lead package, wherein the package includes:
- a housing having a first side and second side;
- a circuit disposed within the housing;
- and an exposed thermal belly pad that is thermally coupled to the circuit and that passes at least partially through the first side;
- and
- a printed circuit board (PCB) having traces formed on a first side thereof, wherein the flat no-lead package is attached to a first side of the PCB such that the exposed thermal belly pad is opposite the first side of the PCB.
Dependencies are inferred from the claim text.