Component Carrier With Embedded Component Having Pads Connected in Different Wiring Layers

A method of manufacturing a component carrier, the method comprising:

• forming a stack comprising at least one electrically insulating layer structure and a plurality of electrically conductive layer structures;
• embedding a component, comprising an array of pads on a main surface of the component, in the stack;
• electrically connecting a first pad of the pads up to a first wiring plane by a first electrically conductive connection structure of the electrically conductive layer structures;
• and
• electrically connecting a second pad of the pads up to a second wiring plane, being different from the first wiring plane, by a second electrically conductive connection structure of the electrically conductive layer structures.