Component carrier with embedded component having pads connected in different wiring layers

A component carrier, comprising:

• a stack comprising at least one electrically insulating layer structure and a plurality of electrically conductive layer structures;
• a component embedded in the stack and comprising an array of pads on a main surface of the component;
• wherein a first electrically conductive connection structure of the electrically conductive layer structures electrically connects a first pad of the pads only up to a first wiring plane;
• wherein a second electrically conductive connection structure of the electrically conductive layer structures electrically connects a second pad of the pads only up to a second wiring plane being different from the first wiring plane;
• wherein a third electrically conductive connection structure of the electrically conductive layer structures electrically connects a third pad of the pads only up to a third wiring plane being different from the first wiring plane and the second wiring plane, wherein the third electrically conductive connection structure is composed of a third trace extending along a horizontal direction in the third wiring plane and a plurality of at least three, directly connected vertical through-connections connecting the third pad with the third trace.