H05K 2201/10469
Asymmetrically mounted component
H05K2201/10469 (Asymmetrically mounted component) appears on 13 US grants and 10 published applications in this corpus.
Search patents in H05K- Granted patents
- 13
- Published applications
- 10
- Assignees
- 15
- Inventors
- 40
- Latest grant
- 29 Nov 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 2 | 2 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Package-in-substrate, semiconductor device and module29 Nov 2016US 9,508,639 B2Rohm Co., Ltd.
- Method for mounting semiconductor chips on a substrate and corresponding assembly13 Apr 2010US 7,696,001 B2Robert Bosch GmbH
- Motor drive circuit and outdoor unit for air conditioner5 Jan 2010US 7,643,296 B2Mitsubishi Electric Corporation
- Ceramic capacitor mounting structure and ceramic capacitor29 Apr 2008US 7,365,957 B2TDK Corporation
- Electrical devices8 Apr 2008US 7,355,504 B2Tyco Electronics Corporation
- Inductor Mountable on a Circuit Board17 Aug 2023US 2023/0260690 A1ABB Schweiz AG
- Package-in-substrate, semiconductor device and module11 Feb 2016US 2016/0043028 A1Rohm Co., Ltd.
- Alignment of components coupled to a flexible substrate for wearable devices28 May 2015US 2015/0146355 A1AliphCom
- Method of soldering electronic component, and electronic component16 Sep 2010US 2010/0230152 A1Fujitsu Limited
- Stacked multilayer capacitor27 Nov 2008US 2008/0291602 A1
Most cited
By later US patents
- Electrical devices70US 5,852,397 ARaychem Corporation · 1998
- Motor drive circuit and outdoor unit for air conditioner26US 7,643,296 B2Mitsubishi Electric Corporation · 2010
- Surface-mounting type semiconductor package having an improved efficiency for heat dissipation24US 5,305,179 AFujitsu Limited · 1994
- Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted8US 4,766,426 AMatsushita Electric Industrial Co., Ltd. · 1988
- Electrical devices7US 6,651,315 B1Tyco Electronics Corporation · 2003