Stacked multilayer capacitor
OwnerDaniel Devoeinventor
Life of this patent
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Abstract
A capacitor device, which is mountable on a substrate, has an electrically conductive bottom lead frame with a bottom plate mountable substantially parallel to, and in contact with, the substrate and an electrically conductive top lead frame having a top plate spaced apart from the bottom plate and a first transition portion having a first end connected to the top plate and a second end, opposite the first end, electrically connectable to the substrate. Multilayer capacitors are mounted between the top plate and the bottom plate. The capacitors have opposed end terminations electrically connected to the top and bottom plates, such that internal electrode plates are substantially nonparallel to the substrate.
Claims34
A capacitor device mountable on a plane of a substrate comprising:
- an electrically conductive bottom plate adapted to be mounted substantially parallel to, and in electrical contact at the plane of the substrate;
- a first multilayer capacitor comprising substantially parallel first and second electrode plates oriented substantially perpendicular to the bottom plate with the first electrode plates being electrically connected to the bottom plate;
- and
- an electrically conductive top lead frame overlapping with, and electrically isolated from, the bottom plate, the top lead frame electrically connected to the second electrode plates and adapted to be electrically connected at the plane of the substrate.
A capacitor device mountable on a plane of a substrate comprising:
- an electrically conductive bottom plate adapted to be mounted substantially parallel to, and in electrical contact at the plane of the substrate;
- a first multilayer capacitor comprising substantially parallel first and second electrode plates oriented substantially nonparallel to the bottom plate with the first electrode plates being electrically connected to the bottom plate;
- and
- an electrically conductive top lead frame overlapping with, and electrically isolated from, the bottom plate, the top lead frame electrically connected to the second electrode plates and adapted to be electrically connected at the plane of the substrate.
An apparatus for connecting multilayer capacitors to a plane of a substrate, the multilayer capacitors having respective first end terminations and respective second end terminations, the apparatus comprising:
- an electrically conductive bottom plate adapted to be mounted substantially parallel to the substrate, the bottom plate comprising a first side adapted to be in contact with, and electrically connected at the plane of the substrate, and the bottom plate further comprising an opposed second side adapted to be electrically connected to the respective first end terminations of the multilayer capacitors;
- an electrically conductive top plate spaced apart from and overlapping the bottom plate adapted to be oriented substantially parallel to the substrate and further adapted to be connected to the respective second end terminations of the multilayer capacitors;
- and
- an electrically conductive first transition portion having a first end connected to the top plate and a second end opposite the first end adapted to be electrically connected at the plane of the substrate.
A PC board assembly comprising:
- a PC board having a first conductor and a second conductor at the plane of the PC board;
- and
- a capacitor device comprising:
- an electrically conductive bottom plate adapted to be mounted substantially parallel to, and in electrical contact with the first conductor at the plane of the PC board;
- a first multilayer capacitor comprising substantially parallel first and second electrode plates oriented substantially nonparallel to the bottom plate with the first electrode plates being electrically connected to the bottom plate;
- and
- an electrically conductive top lead frame overlapping with, and electrically isolated from, the bottom plate, the top lead frame electrically connected to the second electrode plates and adapted to be electrically connected to the second conductor at the plane of the PC board.
A PC board assembly comprising:
- a PC board having a first conductor and a second conductor at a plane of the PC board;
- and
- a capacitor device comprising:
- a first multilayer capacitor comprising substantially parallel first and second electrode plates oriented substantially nonparallel to the PC board with the first electrode plates being electrically connected to the first conductor at the plane of the of the PC board;
- and
- an electrically conductive top lead frame overlapping with, and electrically isolated from, the first conductor, the top lead frame electrically connected to the second electrode plates and adapted to be electrically connected to the second conductor at the plane of the PC board.
Dependencies are inferred from the claim text.