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US 9,508,639 B2Granted
Package-in-substrate, semiconductor device and module
AssigneeRohm Co., Ltd.
InventorHirotoshi Usui
Life of this patent
Estimating the term…
Abstract
A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.
Claims15
A package-in-substrate, comprising:
- an exposed pad having a surface that is capable of contacting the outside;
- a semiconductor chip arranged on a surface opposite to the surface of the exposed pad;
- a substrate in which a package is embedded;
- a molding resin for molding the semiconductor chip;
- and
- a lead frame extending from a side surface of the molding resin and having a leading end portion having a terminating edge,
- wherein the lead frame is formed to contact the substrate, and the leading end portion of the lead frame terminates in acute angled surfaces with respect to a top surface of the substrate and the terminating edge being parallel to the top surface of the substrate and directly contacting the top surface of the substrate.
4 more elements
A package-in-substrate, comprising:
- a substrate in which a package is arranged;
- an exposed pad having a surface that is capable of contacting the outside;
- a semiconductor chip arranged on a surface opposite to the surface of the exposed pad;
- a molding resin for molding the semiconductor chip;
- and
- a lead frame extending from a side surface of the molding resin, the lead frame contacting the substrate and having a leading end portion having a terminating edge,
- wherein the leading end portion of the lead frame terminates in acute angled surfaces with respect to a top surface of the substrate and the terminating edge being parallel to the top surface of the substrate and directly contacting the top surface of the substrate, and
- wherein the lead frame is formed such that a height position of a top portion of the lead frame is relatively low compared to a height position of the surface of the exposed pad.
5 more elements
Dependencies are inferred from the claim text.