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US 2016/0043028 A1Published application
Package-in-substrate, semiconductor device and module
AssigneeRohm Co., Ltd.
InventorHirotoshi USUI
Life of this patent
Estimating the term…
Abstract
A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.
Claims17
A package-in-substrate, comprising:
- an exposed pad having a surface that is capable of contacting the outside;
- a semiconductor chip arranged on a surface opposite to the surface of the exposed pad;
- a molding resin for molding the semiconductor chip;
- and
- a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape,
- wherein the leading end portion of the lead frame is cut to have a cutting angle that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.
3 more elements
A package-in-substrate, comprising:
- a substrate in which a package is arranged;
- an exposed pad having a surface that is capable of contacting the outside;
- a semiconductor chip arranged on a surface opposite to the surface of the exposed pad;
- a molding resin for molding the semiconductor chip;
- and
- a lead frame extending from a side surface of the molding resin, the lead frame contacting the substrate and having a leading end portion with a machined shape,
- wherein the leading end portion of the lead frame is cut to have a cutting angle that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of the package and the substrate,
- wherein the leading end portion of the lead frame has a cutting surface parallel to the top surface of the package and the substrate, and
- wherein the lead frame is formed such that a height position of a top portion of the lead frame is relatively low compared to a height position of the surface of the exposed pad.
6 more elements
Dependencies are inferred from the claim text.