Method for mounting semiconductor chips on a substrate and corresponding assembly

A method for mounting a semiconductor chip on a substrate using flip-chip technology, the method comprising:

• a) providing a semiconductor chip having a component region and an edge region, wherein the component region includes a component, and wherein a mounting region including a set of bonding pads is situated in the edge region;
• b) providing a substrate having a surface including a set of lands, the set of lands on the substrate forming a first land row and a second land row, the first land row and the second land row being aligned parallel to each other;
• c) applying a soldering material to at least one of:
• i) the set of bonding pads;
• and ii) the set of lands, whereby a first bump row and a second bump row are formed;
• d) positioning the semiconductor chip on the substrate;
• and
• e) differential melting of the soldering material of the first bump row and the second bump row by a soldering process, whereby the mounting region of the semiconductor chip is moved towards the substrate due to surface tension of the melting soldering material of the first bump row and the component region is lifted away from the substrate by a resulting rotation around the second bump row, the second bump row acting as an axis of rotation between the mounting region and the component region.