Method of soldering electronic component, and electronic component
AssigneeFujitsu Limited
InventorTakahiro KITAGAWA
Life of this patent
Estimating the term…
Abstract
A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.
Claims10
A method of soldering an electronic component, the method comprising:
- providing solder onto a printed circuit board electrode of a printed circuit board,
- placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member interposed therebetween that melts with heat, the electronic component supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board;
- and
- heating the solder and the component-supporting member.
An electronic component to be mounted on a printed circuit board, the electronic component comprising:
- a component body;
- a component electrode provided on the component body;
- and
- a component-supporting member that melts with heat, that is provided on the component electrode, and that supports one side of the electronic component on the printed circuit board.
Dependencies are inferred from the claim text.