H05K 2201/10348
Fuzz's as connector elements, i.e. small pieces of metallic fiber to make
Official title: Fuzz's as connector elements, i.e. small pieces of metallic fiber to make connection
H05K2201/10348 (Fuzz's as connector elements, i.e. small pieces of metallic fiber to make) appears on 13 US grants and 14 published applications in this corpus.
Search patents in H05K- Granted patents
- 13
- Published applications
- 14
- Assignees
- 9
- Inventors
- 33
- Latest grant
- 11 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 3 |
| 2005 | 1 | 1 |
| 2006 | 2 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
By publication year.
Recent patents
- Interconnection of printed circuit boards with nanowires11 Nov 2025US 12,471,203 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resilient micro lattice electrical interconnection assembly2 Jul 2024US 12,028,978 B2Northrop Grumman Systems Corporation
- Solderless BGA interconnect7 Nov 2023US 11,811,182 B2Intel Corporation
- Resilient micro lattice electrical interconnection assembly21 Sep 2021US 11,129,277 B2Northrop Grumman Systems Corporation
- Resilient micro lattice electrical interconnection assembly16 Oct 2018US 10,104,773 B2Northrop Grumman Systems Corporation
- Interconnection of printed circuit boards with nanowires5 Oct 2023US 2023/0319976 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resilient micro lattice electrical interconnection assembly25 Nov 2021US 2021/0368622 A1Northrop Grumman Systems Corporation
- Solderless bga interconnect16 Apr 2020US 2020/0119467 A1Intel Corporation
- Resilient micro lattice electrical interconnection assembly27 Dec 2018US 2018/0376595 A1Northrop Grumman Systems Corporation
- Resilient micro lattice electrical interconnection assembly27 Jul 2017US 2017/0215286 A1Northrop Grumman Systems Corporation
Most cited
By later US patents
- Electronic package with thermally conductive standoff43US 6,631,078 B2International Business Machines Corporation · 2003
- Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards20US 6,417,747 B1Raytheon Company · 2002
- Land grid array structure6US 6,954,984 B2International Business Machines Corporation · 2005
- Micro-bumps to enhance LGA interconnections4US 7,302,757 B2International Business Machines Corporation · 2007
- Capacitor mounting structure3US 6,989,995 B2Mitsubishi Denki Kabushiki Kaisha · 2006