Solderless BGA interconnect

An electronics package, comprising:

• a first substrate;
• a plurality of first conductive pads on the first substrate;
• a second substrate;
• a plurality of second conductive pads on the second substrate;
• and
• a plurality of interconnects between the first and second substrate, wherein each interconnect electrically couples one of the first conductive pads to one of the second conductive pads, and wherein each of the interconnects comprises a plurality of strands of conductive material, wherein the plurality of strands of conductive material of each interconnect are woven on themselves to form a mesh-like structure, and wherein each of the plurality of strands of conductive material of each interconnect comprises a conductive core, and a protective shell a round the conductive core;
• and
• each of the plurality of strands have a diameter equal to or less than 100 microns and the interconnect has a form factor that matches with a form factor of a solder ball of a Ball Grid Array.