Resilient micro lattice electrical interconnection assembly

An assembly in which electrical interconnections are made among parallel, spaced apart, printed circuit boards (PCBs) comprising:

• a first PCB with a conductive area on its surface;
• a resilient, conductive, three dimensional, micro lattice truss structure with a first end permanently attached to the conductive area and a second distal end opposing the first end;
• the truss structure extending substantially perpendicular and outward from the first PCB;
• a second PCB having conductive area on a surface facing the first PCB;
• the truss structure including layers of interconnected trusses with each truss having a plurality of spaced-apart, elongated strands, one end of certain of the strands engaging an adjacent bottom truss layer and the other end of the certain strands engaging an adjacent top truss layer;
• the assembly being in an unengaged state when the second distal end of the truss structure is not in engagement with the conductive area on the second PCB and the truss structure is not compressed in a direction towards the first PCB;
• the assembly being in an engaged state when the first and second PCBs are close enough to each other that the conductive area on the second PCB engages the second distal end of the truss structure and compresses the truss structure in a direction towards the first PCB, the truss structure in the engaged state establishing an electrical connection between the conductive area on the first PCB and the conductive area on the second PCB.